US PATENT SUBCLASS 438 / 690
.~ Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.)

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

689  DF  CHEMICAL ETCHING {6}
690.~ Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) {1}
691  DF  .~.~> Combined mechanical and chemical material removal {1}

DEFINITION

Classification: 438/690

Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.):

(under subclass 689) Processes wherein the chemical removal is accompanied by the removal, either concurrently or consecutively, of material by nonchemical means.