US PATENT SUBCLASS 438 / 691
.~.~ Combined mechanical and chemical material removal

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

689  DF  CHEMICAL ETCHING {6}
690  DF  .~ Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) {1}
691.~.~ Combined mechanical and chemical material removal {1}
692  DF  .~.~.~> Simultaneous (e.g., chemical-mechanical polishing, etc.) {1}

DEFINITION

Classification: 438/691

Combined mechanical and chemical material removal:

(under subclass 690) Processes wherein the nonchemical material removal is a mechanical (e.g., abrading, cutting, etc.) removal method.