US PATENT SUBCLASS 438 / 692
.~.~.~ Simultaneous (e.g., chemical-mechanical polishing, etc.)

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

689  DF  CHEMICAL ETCHING {6}
690  DF  .~ Combined with the removal of material by nonchemical means (e.g., ablating, abrading, etc.) {1}
691  DF  .~.~ Combined mechanical and chemical material removal {1}
692.~.~.~ Simultaneous (e.g., chemical-mechanical polishing, etc.) {1}
693  DF  .~.~.~.~> Utilizing particulate abradant

DEFINITION

Classification: 438/692

Simultaneous (e.g., chemical-mechanical polishing, etc.):

(under subclass 691) Processes wherein the chemical and mechanical material removal processes are concurrent.