US PATENT SUBCLASS 438 / 669
.~.~ And patterning of conductive layer

Current as of: June, 1999
Click HD for Main Headings
Click for All Classes

Internet Version by PATENTEC © 1999      Terms of Use


438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

584  DF  COATING WITH ELECTRICALLY OR THERMALLY CONDUCTIVE MATERIAL {2}
597  DF  .~ To form ohmic contact to semiconductive material {24}
669.~.~ And patterning of conductive layer {4}
670  DF  .~.~.~> Utilizing lift-off
671  DF  .~.~.~> Utilizing multilayered mask
672  DF  .~.~.~> Plug formation (i.e., in viahole)
673  DF  .~.~.~> Tapered etching

DEFINITION

Classification: 438/669

And patterning of conductive layer:

(under subclass 597) Processes including the selective removal of portions of the conductive layer formed upon the semiconductor substrate.