US PATENT SUBCLASS 438 / 673
.~.~.~ Tapered etching

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

584  DF  COATING WITH ELECTRICALLY OR THERMALLY CONDUCTIVE MATERIAL {2}
597  DF  .~ To form ohmic contact to semiconductive material {24}
669  DF  .~.~ And patterning of conductive layer {4}
673.~.~.~ Tapered etching

DEFINITION

Classification: 438/673

Tapered etching:

(under subclass 669) Processes wherein the patterning step is accomplished through a tapering etching step.