438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
584 | DF | COATING WITH ELECTRICALLY OR THERMALLY CONDUCTIVE MATERIAL {2} |
597 | DF | .~ To form ohmic contact to semiconductive material {24} |
652 | .~.~ Plural layered electrode or conductor {5} | |
653 | DF | .~.~.~> At least one layer forms a diffusion barrier |
654 | DF | .~.~.~> Having adhesion promoting layer |
655 | DF | .~.~.~> Silicide |
656 | DF | .~.~.~> Having refractory group metal (i.e., titanium (Ti), zirconium (Zr), hafnium (Hf), vanadium (V), niobium (Nb), tantalum (Ta), chromium (Cr), molybdenum (Mo), tungsten (W), or alloy thereof) |
657 | DF | .~.~.~> Having electrically conductive polysilicon component |