US PATENT SUBCLASS 438 / 654
.~.~.~ Having adhesion promoting layer

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

584  DF  COATING WITH ELECTRICALLY OR THERMALLY CONDUCTIVE MATERIAL {2}
597  DF  .~ To form ohmic contact to semiconductive material {24}
652  DF  .~.~ Plural layered electrode or conductor {5}
654.~.~.~ Having adhesion promoting layer

DEFINITION

Classification: 438/654

Having adhesion promoting layer:

(under subclass 652) Processes wherein a material (e.g., layer, etc.) is utilized to promote adhesion of the electrical contact or lead to an adjacent surface.