US PATENT SUBCLASS 438 / 633
.~.~.~.~.~ Simultaneously by chemical and mechanical means

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

584  DF  COATING WITH ELECTRICALLY OR THERMALLY CONDUCTIVE MATERIAL {2}
597  DF  .~ To form ohmic contact to semiconductive material {24}
618  DF  .~.~ Contacting multiple semiconductive regions (i.e., interconnects) {5}
622  DF  .~.~.~ Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) {8}
631  DF  .~.~.~.~ Having planarization step {3}
633.~.~.~.~.~ Simultaneously by chemical and mechanical means

DEFINITION

Classification: 438/633

Simultaneously by chemical and mechanical means:

(under subclass 631) Processes wherein the planarization step is conducted by the simultaneous chemical and mechanical material removal.

SEE OR SEARCH THIS CLASS, SUBCLASS:

692, for a process of chemical-mechanical polishing of a semiconductor substrate.