438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
584 | DF | COATING WITH ELECTRICALLY OR THERMALLY CONDUCTIVE MATERIAL {2} |
597 | DF | .~ To form ohmic contact to semiconductive material {24} |
618 | DF | .~.~ Contacting multiple semiconductive regions (i.e., interconnects) {5} |
622 | DF | .~.~.~ Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) {8} |
625 | DF | .~.~.~.~ At least one metallization level formed of diverse conductive layers {4} |
627 | .~.~.~.~.~ At least one layer forms a diffusion barrier |