US PATENT SUBCLASS 438 / 455
BONDING OF PLURAL SEMICONDUCTOR SUBSTRATES

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

455BONDING OF PLURAL SEMICONDUCTOR SUBSTRATES {4}
456  DF  .~> Having enclosed cavity
457  DF  .~> Warping of semiconductor substrate
458  DF  .~> Subsequent separation into plural bodies (e.g., delaminating, dicing, etc.)
459  DF  .~> Thinning of semiconductor substrate

DEFINITION

Classification: 438/455

BONDING OF PLURAL SEMICONDUCTOR SUBSTRATES:

(under the class definition) Process in which plural semiconductive substrates are joined together into a coherent body, such as by thermal treatment.

(1) Note. Connection of electrical terminals on transposed semiconductive substrates by joining the respective terminals on one substrate to the terminals on a second substrate (e.g., flip-chip bonding, etc.) is a packaging operation and as such cross-referencing hereunder is discouraged.

SEE OR SEARCH THIS CLASS, SUBCLASS:

107, for a process of packaging (e.g., mounting, encapsulating, etc.) involving the assembly of plural semiconductive substrates or the treating of a packaged device containing the same.

406, for a process of making a full electrical isolation structure including a laminating step whereby current flow will be minimized between laterally adjoining semiconductive regions.

SEE OR SEARCH CLASS

65, Glass Manufacturing, particularly 36+, for fusion bonding of glass to a formed part. While Class 65 considers silicon and silicon dioxide glass, and hence takes the melting, shaping or fusion bonding of the same (as well as combined operations whether preparatory or subsequent to the melting, shaping, or fusion bonding step), if the structure formed is identified as having utility for semiconductor electrical devices, placement is proper in Class 438.

117, Single-Crystal, Oriented-Crystal, and Epitaxy Growth Processes; Non-Coating Apparatus Therefor,

1, for processes of joining independent crystals.

156, Adhesive Bonding and Miscellaneous Chemical Manufacture,

60+, for a per se process of adhesive bonding or assembly therefor of plural preforms.

228, Metal Fusion Bonding, for processes of metal fusion bonding of semiconductive substrates.