US PATENT SUBCLASS 438 / 459
.~ Thinning of semiconductor substrate

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

455  DF  BONDING OF PLURAL SEMICONDUCTOR SUBSTRATES {4}
459.~ Thinning of semiconductor substrate

DEFINITION

Classification: 438/459

Thinning of semiconductor substrate:

(under subclass 455) Process for joining plural semiconductive substrates into an integral body having a step of reducing the thickness of at least one of the semiconductive substrates.