US PATENT SUBCLASS 438 / 458
.~ Subsequent separation into plural bodies (e.g., delaminating, dicing, etc.)

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

455  DF  BONDING OF PLURAL SEMICONDUCTOR SUBSTRATES {4}
458.~ Subsequent separation into plural bodies (e.g., delaminating, dicing, etc.)

DEFINITION

Classification: 438/458

Subsequent separation into plural bodies (e.g., delaminating, dicing, etc.):

(under subclass 455) Process for joining plural semiconductive substrates into an integral body having a step of dividing the integral body into plural individual bodies subsequent to the joining operation.