US PATENT SUBCLASS 438 / 457
.~ Warping of semiconductor substrate

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

455  DF  BONDING OF PLURAL SEMICONDUCTOR SUBSTRATES {4}
457.~ Warping of semiconductor substrate

DEFINITION

Classification: 438/457

Warping of semiconductor substrate:

(under subclass 455) Process for joining plural semiconductive substrates into an integral body including a step of bending one or more of the semiconductor substrates to be joined.