438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
400 | DF | FORMATION OF ELECTRICALLY ISOLATED LATERAL SEMICONDUCTIVE STRUCTURE {10} |
439 | DF | .~ Recessed oxide by localized oxidation (i.e., LOCOS) {9} |
444 | DF | .~.~ Preliminary etching of groove {1} |
445 | DF | .~.~.~ Masking of groove sidewall {2} |
446 | .~.~.~.~ Polysilicon containing sidewall |