US PATENT SUBCLASS 382 / 145
.~.~ Inspection of semiconductor device or printed circuit board

Current as of: June, 1999
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382 /   HD   IMAGE ANALYSIS

100  DF  APPLICATIONS {20}
141  DF  .~ Manufacturing or product inspection {5}
145.~.~ Inspection of semiconductor device or printed circuit board {5}
146  DF  .~.~.~> Measuring external leads
147  DF  .~.~.~> Inspecting printed circuit boards
148  DF  .~.~.~> At plural magnifications or resolutions
149  DF  .~.~.~> Fault or defect detection {1}
151  DF  .~.~.~> Alignment, registration, or position determination

DEFINITION

Classification: 382/145

Inspection of semiconductor device or printed circuit board:

(under subclass 141) Subject matter wherein semiconductor wafers, chips, or similar materials or an insulating board on which circuit has been printed are inspected for defect detection, dimension checking, mark reading, or other conditions.

SEE OR SEARCH CLASS

29, Metal Working,

833, for assembling an electrical component to an insulating base utilizing an optical sighting means.

438, Semiconductor Device Manufacturing: Process, particularly

16, for methods of treating electronically functioning semiconductor substrates including a step of measuring an optical characteristic of the process or of the electronic device.