US PATENT SUBCLASS 216 / 75
.~.~ Substrate contains elemental metal, alloy thereof, or metal compound

Current as of: June, 1999
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216 /   HD   ETCHING A SUBSTRATE: PROCESSES

58  DF  GAS PHASE ETCHING OF SUBSTRATE {6}
74  DF  .~ Etching inorganic substrate {3}
75.~.~ Substrate contains elemental metal, alloy thereof, or metal compound {3}
76  DF  .~.~.~> Etching of substrate containing at least one compound having at least one oxygen atom and at least one metal atom
77  DF  .~.~.~> Etching of substrate containing elemental aluminum, or an alloy or compound thereof
78  DF  .~.~.~> Etching of substrate containing elemental copper, or an alloy or compound thereof

DEFINITION

Classification: 216/75

Substrate contains elemental metal, alloy thereof, or metal compound:

(under subclass 74) Process wherein the substrate contains metal in elemental, alloy, or compound form.

SEE OR SEARCH THIS CLASS, SUBCLASS:

100+, for nongaseous phase etching of an elemental metal, alloy, or metal compound containing substrate.