US PATENT SUBCLASS 216 / 68
.~.~.~ Using coil to generate the plasma

Current as of: June, 1999
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216 /   HD   ETCHING A SUBSTRATE: PROCESSES

58  DF  GAS PHASE ETCHING OF SUBSTRATE {6}
63  DF  .~ Application of energy to the gaseous etchant or to the substrate being etched {4}
67  DF  .~.~ Using plasma {3}
68.~.~.~ Using coil to generate the plasma

DEFINITION

Classification: 216/68

Using coil to generate the plasma:

(under subclass 67) Process wherein a plasma is produced by the use of a coil, e.g., external induction coil, etc.