US PATENT SUBCLASS 204 / 298.21
.~.~.~.~.~ Cylindrical or curved magnetron target

Current as of: June, 1999
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204 /   HD   CHEMISTRY: ELECTRICAL AND WAVE ENERGY

193  DF  APPARATUS {5}
298.01  DF  .~ Coating, forming or etching by sputtering {2}
298.02  DF  .~.~ Coating {13}
298.16  DF  .~.~.~ Magnetically enchanced {1}
298.17  DF  .~.~.~.~ Flux passes through target surface {3}
298.21.~.~.~.~.~ Cylindrical or curved magnetron target {1}
298.22  DF  .~.~.~.~.~.~> Moving magnetic field or target

DEFINITION

Classification: 204/298.21

Cylindrical or curved magnetron target:

(under subclass 298.17) Apparatus including a magnetically enhanced curved sputtering target surface which may be of cylindrical geometry.

(1) Note. Cylindrical Sputtering targets may be solid or hollow and, if hollow, sputtering may be from either the inside or outside surface.