US PATENT SUBCLASS 204 / 192.15
.~.~.~ Specified deposition material or use

Current as of: June, 1999
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204 /   HD   CHEMISTRY: ELECTRICAL AND WAVE ENERGY

*  DD  PROCESSES AND PRODUCTS {7}
192.1  DF  .~ Coating, forming or etching by sputtering {3}
192.12  DF  .~.~ Glow discharge sputter deposition (e.g., cathode sputtering, etc.) {3}
192.15.~.~.~ Specified deposition material or use {10}
192.16  DF  .~.~.~.~> Wear or abrasion resistant
192.17  DF  .~.~.~.~> Electrical contact material
192.18  DF  .~.~.~.~> Piezoelectric
192.2  DF  .~.~.~.~> Ferromagnetic
192.21  DF  .~.~.~.~> Resistor
192.22  DF  .~.~.~.~> Insulator or dielectric {1}
192.24  DF  .~.~.~.~> Superconductor
192.25  DF  .~.~.~.~> Semiconductor
192.26  DF  .~.~.~.~> Optical or photoactive {3}
192.3  DF  .~.~.~.~> With sputter etching

DEFINITION

Classification: 204/192.15

Specified deposition material or use:

(under subclass 192.12) Processes wherein the target or deposition material has a designated chemical composition or the function of the product is specified.

(1) Note. A designated chemical composition (DCC) is a composition wherein at least one chemical atom is identified. for a more comprehensive definition of DCC, see DEFINITIONS OF TERMS, under the main definitions of this class.