US PATENT SUBCLASS 204 / 192.3
.~.~.~.~ With sputter etching

Current as of: June, 1999
Click HD for Main Headings
Click for All Classes

Internet Version by PATENTEC © 1999      Terms of Use


204 /   HD   CHEMISTRY: ELECTRICAL AND WAVE ENERGY

*  DD  PROCESSES AND PRODUCTS {7}
192.1  DF  .~ Coating, forming or etching by sputtering {3}
192.12  DF  .~.~ Glow discharge sputter deposition (e.g., cathode sputtering, etc.) {3}
192.15  DF  .~.~.~ Specified deposition material or use {10}
192.3.~.~.~.~ With sputter etching

DEFINITION

Classification: 204/192.3

With sputter etching:

(under subclass 192.15) Processes wherein a sputter etching step is included in the process in addition to the sputter deposition step.