US PATENT SUBCLASS 204 / 192.1
.~ Coating, forming or etching by sputtering

Current as of: June, 1999
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204 /   HD   CHEMISTRY: ELECTRICAL AND WAVE ENERGY

*  DD  PROCESSES AND PRODUCTS {7}
192.1.~ Coating, forming or etching by sputtering {3}
192.11  DF  .~.~> Ion beam sputter deposition
192.12  DF  .~.~> Glow discharge sputter deposition (e.g., cathode sputtering, etc.) {3}
192.32  DF  .~.~> Sputter etching {3}

DEFINITION

Classification: 204/192.1

Coating, forming or etching by sputtering:

Processes for coating, forming or etching within a vacuum environment involving bombarding a solid or liquid target material with atomic particles (e.g., ions) to cause some target material to be ejected (i.e., sputtered) by momentum

transfer.

(1) Note. Solid or liquid material being bombarded is generally referred to as the target material.

(2) Note. Material removed from the target may be used to deposit a coating on a workpiece, to etch a workpiece or to form a product, e.g., particles, flakes, etc.

SEE OR SEARCH THIS CLASS, SUBCLASS:

298.01, for corresponding apparatus.

471+, for electrophoretic or electro-osmotic coating or forming of an object.

SEE OR SEARCH CLASS 205, Electrolysis: Processes, Compositions Used Therein, and Methods of Preparing the Compositions

67+, for electroforming or a composition therefor and subclasses 80+ for electrolytic coating.