US PATENT SUBCLASS 204 / 192.12
.~.~ Glow discharge sputter deposition (e.g., cathode sputtering, etc.)

Current as of: June, 1999
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204 /   HD   CHEMISTRY: ELECTRICAL AND WAVE ENERGY

*  DD  PROCESSES AND PRODUCTS {7}
192.1  DF  .~ Coating, forming or etching by sputtering {3}
192.12.~.~ Glow discharge sputter deposition (e.g., cathode sputtering, etc.) {3}
192.13  DF  .~.~.~> Measuring or testing (e.g., of operating parameters, property of article, etc.)
192.14  DF  .~.~.~> Coating inorganic material onto polymeric material
192.15  DF  .~.~.~> Specified deposition material or use {10}

DEFINITION

Classification: 204/192.12

Glow discharge sputter deposition (e.g., cathode sputtering, etc.):

(under subclass 192.1) Processes for the deposition of target material onto a surface (or substrate) wherein material is sputtered from the target in the presence of a glow discharge, e.g., cathode sputtering, etc.