438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
FOR 385 | DF | INCLUDING COATING OR MATERIAL REMOVAL, E.G., ETCHING, GRINDING, ETC. (437/ 225) {9} |
FOR 395 | DF | .~ Of a dielectric or insulative material (437/235) {4} |
FOR 403 | DF | .~.~ Directly on semiconductor substrate (437/243) {1} |
FOR 404 | .~.~.~ By chemical conversion of substrate (437/244) |