US PATENT SUBCLASS 438 / FOR 385
INCLUDING COATING OR MATERIAL REMOVAL, E.G., ETCHING, GRINDING, ETC. (437/ 225)

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

FOR 385INCLUDING COATING OR MATERIAL REMOVAL, E.G., ETCHING, GRINDING, ETC. (437/ 225) {9}
FOR 386  DF  .~> Substrate dicing (437/226) {1}
FOR 388  DF  .~> Coating and etching (437/228)
FOR 389  DF  .~> Of radiation resist layer (437/229)
FOR 390  DF  .~> By immersion metal plating from solution, i.e., electroless plating (437/230)
FOR 391  DF  .~> By spinning (437/231)
FOR 392  DF  .~> Elemental Se (Selenium) substrate or coating (437/232)
FOR 393  DF  .~> Of polycrystalline semiconductor material on substrate (437/233) {1}
FOR 395  DF  .~> Of a dielectric or insulative material (437/235) {4}
FOR 405  DF  .~> Comprising metal layer (437/245) {1}

DEFINITION

Classification: 438/FOR.385

INCLUDING COATING OR MATERIAL REMOVAL, E.G., ETCHING, GRINDING, ETC.:

Foreign art collection for processes having the step of (1) covering or impregnating, or (2) wearing away of a portion of (as by acid, abrasion, etc.) a semiconductor.