| 438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
| FOR 385 | DF | INCLUDING COATING OR MATERIAL REMOVAL, E.G., ETCHING, GRINDING, ETC. (437/ 225) {9} |
| FOR 395 | ![]() | .~ Of a dielectric or insulative material (437/235) {4} |
| FOR 396 | DF | .~.~> Containing Group III atom (437/236) {1} |
| FOR 398 | DF | .~.~> Monoxide or dioxide or Ge (Germanium) or Si (Silicon) (437/238) {2} |
| FOR 401 | DF | .~.~> Si (Silicon) and N (Nitrogen) (437/241) {1} |
| FOR 403 | DF | .~.~> Directly on semiconductor substrate (437/243) {1} |