US PATENT SUBCLASS 438 / FOR 403
.~.~ Directly on semiconductor substrate (437/243)

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

FOR 385  DF  INCLUDING COATING OR MATERIAL REMOVAL, E.G., ETCHING, GRINDING, ETC. (437/ 225) {9}
FOR 395  DF  .~ Of a dielectric or insulative material (437/235) {4}
FOR 403.~.~ Directly on semiconductor substrate (437/243) {1}
FOR 404  DF  .~.~.~> By chemical conversion of substrate (437/244)

DEFINITION

Classification: 438/FOR.403

Directly on semiconductor substrate:

Foreign art collection for processes wherein the coating or etchant is applied to the nonconducting substrate which is located on a semiconductor substrate.