438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
FOR 385 | DF | INCLUDING COATING OR MATERIAL REMOVAL, E.G., ETCHING, GRINDING, ETC. (437/ 225) {9} |
FOR 395 | DF | .~ Of a dielectric or insulative material (437/235) {4} |
FOR 401 | DF | .~.~ Si (Silicon) and N (Nitrogen) (437/241) {1} |
FOR 402 | .~.~.~ By chemical reaction with substrate (437/242) |