438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
FOR 385 | DF | INCLUDING COATING OR MATERIAL REMOVAL, E.G., ETCHING, GRINDING, ETC. (437/ 225) {9} |
FOR 395 | DF | .~ Of a dielectric or insulative material (437/235) {4} |
FOR 398 | DF | .~.~ Monoxide or dioxide or Ge (Germanium) or Si (Silicon) (437/238) {2} |
FOR 399 | .~.~.~ By reacting with substrate (437/239) |