438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
584 | DF | COATING WITH ELECTRICALLY OR THERMALLY CONDUCTIVE MATERIAL {2} |
597 | DF | .~ To form ohmic contact to semiconductive material {24} |
666 | .~.~ Specified configuration of electrode or contact {2} | |
667 | DF | .~.~.~> Conductive feedthrough or through-hole in substrate |
668 | DF | .~.~.~> Specified aspect ratio of conductor or viahole |