| 438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
| 584 | DF | COATING WITH ELECTRICALLY OR THERMALLY CONDUCTIVE MATERIAL {2} |
| 597 | DF | .~ To form ohmic contact to semiconductive material {24} |
| 666 | ![]() | .~.~ Specified configuration of electrode or contact {2} |
| 667 | DF | .~.~.~> Conductive feedthrough or through-hole in substrate |
| 668 | DF | .~.~.~> Specified aspect ratio of conductor or viahole |