US PATENT SUBCLASS 438 / 668
.~.~.~ Specified aspect ratio of conductor or viahole

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

584  DF  COATING WITH ELECTRICALLY OR THERMALLY CONDUCTIVE MATERIAL {2}
597  DF  .~ To form ohmic contact to semiconductive material {24}
666  DF  .~.~ Specified configuration of electrode or contact {2}
668.~.~.~ Specified aspect ratio of conductor or viahole

DEFINITION

Classification: 438/668

Specified aspect ratio of conductor or viahole:

(under subclass 666) Processes wherein the width-to-depth ratio or width-to-height ratio of the electrical conductor or the viahole in which the same is to reside is given.