US PATENT SUBCLASS 438 / 667
.~.~.~ Conductive feedthrough or through-hole in substrate

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

584  DF  COATING WITH ELECTRICALLY OR THERMALLY CONDUCTIVE MATERIAL {2}
597  DF  .~ To form ohmic contact to semiconductive material {24}
666  DF  .~.~ Specified configuration of electrode or contact {2}
667.~.~.~ Conductive feedthrough or through-hole in substrate

DEFINITION

Classification: 438/667

Conductive feedthrough or through-hole in substrate:

(under subclass 666) Processes wherein the electrically conductive material is formed upon one surface of the

semiconductor substrate and is able to make electrical contact with the opposing surface of the semiconductor substrate.