US PATENT SUBCLASS 438 / 623
.~.~.~.~ Including organic insulating material between metal levels

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

584  DF  COATING WITH ELECTRICALLY OR THERMALLY CONDUCTIVE MATERIAL {2}
597  DF  .~ To form ohmic contact to semiconductive material {24}
618  DF  .~.~ Contacting multiple semiconductive regions (i.e., interconnects) {5}
622  DF  .~.~.~ Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) {8}
623.~.~.~.~ Including organic insulating material between metal levels

DEFINITION

Classification: 438/623

Including organic insulating material between metal levels:

(under subclass 622) Processes wherein the intervening dielectric is at least partly composed of organic insulating material.

(1) Note. An organic compound is one which fulfills the requirements of the Class 260 definitions (i.e., has a molecule characterized by two carbon atoms bonded together, one atom of carbon being bonded to at least one atom of hydrogen of a halogen, or one atom of carbon bonded to at least one atom of nitrogen by a single or double bond, certain compounds such as HCN, CN-CN, HNCO, HNCS, cyanogen halides, cyanamide, fulminic acid and metal carbides, being exceptions to this rule).