US PATENT SUBCLASS 438 / 575
.~.~.~ Using platinum group metal (i.e., platinum (Pt), palladium (Pd), rodium (Rh), ruthenium (Ru), iridium (Ir), osmium (Os), or alloy thereof)

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

570  DF  FORMING SCHOTTKY JUNCTION (I.E., SEMICONDUCTOR-CONDUCTOR RECTIFYING JUNCTION CONTACT) {4}
572  DF  .~ Compound semiconductor {2}
573  DF  .~.~ Multilayer electrode {2}
575.~.~.~ Using platinum group metal (i.e., platinum (Pt), palladium (Pd), rodium (Rh), ruthenium (Ru), iridium (Ir), osmium (Os), or alloy thereof)

DEFINITION

Classification: 438/575

Using platinum group metal (i.e., platinum (Pt), palladium (Pd), rhodium (Rh), ruthenium (Ru), iridium (Ir), osmium (Os), or alloy thereof):

(under subclass 573) Processes for forming a contact using a platinum group metals (i.e., platinum (Pt), palladium (Pd), rhodium (Rh), ruthenium (Rh), iridium (Ir), osmium (Os), or alloy thereof).