438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
400 | DF | FORMATION OF ELECTRICALLY ISOLATED LATERAL SEMICONDUCTIVE STRUCTURE {10} |
424 | DF | .~ Grooved and refilled with deposited dielectric material {7} |
430 | .~.~ And deposition of polysilicon or noninsulative material into groove {1} | |
431 | DF | .~.~.~> Oxidation of deposited material {1} |