| 438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
| 400 | DF | FORMATION OF ELECTRICALLY ISOLATED LATERAL SEMICONDUCTIVE STRUCTURE {10} |
| 424 | DF | .~ Grooved and refilled with deposited dielectric material {7} |
| 430 | ![]() | .~.~ And deposition of polysilicon or noninsulative material into groove {1} |
| 431 | DF | .~.~.~> Oxidation of deposited material {1} |