US PATENT SUBCLASS 438 / 121
.~ Metallic housing or support

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

106  DF  PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR {10}
121.~ Metallic housing or support {3}
122  DF  .~.~> Possessing thermal dissipation structure (i.e., heat sink)
123  DF  .~.~> Lead frame
124  DF  .~.~> And encapsulating

DEFINITION

Classification: 438/121

Metallic housing or support:

(under subclass 106) Process for mounting, packaging, or encapsulating a semiconductor device wherein a semiconductive substrate is supported or enclosed by joining the substrate to a metallic body.