US PATENT SUBCLASS 438 / 124
.~.~ And encapsulating


Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

106  DF  PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR {10}
121  DF  .~ Metallic housing or support {3}
124.~.~ And encapsulating


DEFINITION

Classification: 438/124

And encapsulating:

(under subclass 121) Process including a step of surrounding the semiconductor substrate or the metallic housing or support with an electrically insulating material which forms a sealed encasement therefor.