US PATENT SUBCLASS 438 / 124
.~.~ And encapsulating
Current as of:
June, 1999
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438 /
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SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS
106
DF
PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR
{10}
121
DF
.~ Metallic housing or support {3}
124
.~.~ And encapsulating
DEFINITION
Classification: 438/124
And encapsulating:
(under subclass 121) Process including a step of surrounding the semiconductor substrate or the metallic housing or support with an electrically insulating material which forms a sealed encasement therefor.