US PATENT SUBCLASS 438 / 123
.~.~ Lead frame

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

106  DF  PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR {10}
121  DF  .~ Metallic housing or support {3}
123.~.~ Lead frame

DEFINITION

Classification: 438/123

Lead frame:

(under subclass 121) Process wherein the metallic body joined to the semiconductor device is in the form of a metallic support with electrically conductive leads depending therefrom.