US PATENT SUBCLASS 438 / 122
.~.~ Possessing thermal dissipation structure (i.e., heat sink)

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

106  DF  PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR {10}
121  DF  .~ Metallic housing or support {3}
122.~.~ Possessing thermal dissipation structure (i.e., heat sink)

DEFINITION

Classification: 438/122

Possessing thermal dissipation structure (i.e., heat sink):

(under subclass 121) Process wherein the metallic body joined to the semiconductor substrate possesses structure for the dissipation of thermal energy generated during operation of the electrical device.

SEE OR SEARCH THIS CLASS, SUBCLASS:

584, for a process of coating a semiconductor substrate with a thermally conductive material (e.g., plated heat sink, etc.)