| 427 / | HD | COATING PROCESSES |
|
| 457 |  | DIRECT APPLICATION OF ELECTRICAL, MAGNETIC, WAVE, OR PARTICULATE ENERGY {15} |
| 458 | DF | .~> Electrostatic charge, field, or force utilized {7} |
| 487 | DF | .~> Polymerization of coating utilizing direct application of electrical, magnetic, wave, or particulate energy (i.e., including cross-linking, curing, and hardening of organics) {8} |
| 523 | DF | .~> Ion plating or implantation {8} |
| 532 | DF | .~> Pretreatment of substrate or post-treatment of coated substrate {9} |
| 561 | DF | .~> Pretreatment of coating supply or source outside of primary deposition zone or off site {4} |
| 569 | DF | .~> Plasma (e.g., corona, glow discharge, cold plasma, etc.) {5} |
| 580 | DF | .~> Electrical discharge (e.g., arcs, sparks, etc.) |
| 581 | DF | .~> Chemical deposition from liquid contiguous with substrate via electron beam or light (e.g., photochemical liquid deposition, etc.) |
| 582 | DF | .~> Photoinitiated chemical vapor deposition (i.e., photo CVD) {2} |
| 585 | DF | .~> Chemical vapor deposition (e.g., electron beam or heating using IR, inductance, resistance, etc.) {2} |
| 591 | DF | .~> Induction or dielectric heating |
| 592 | DF | .~> Resistance heating {2} |
| 595 | DF | .~> Electromagnetic or particulate radiation utilized (e.g., IR, UV, X-ray, gamma ray, actinic, microwave, radio wave, atomic particle; i.e., alpha ray, beta ray, electron, etc.) {1} |
| 598 | DF | .~> Magnetic field or force utilized {1} |
| 600 | DF | .~> Sonic or ultrasonic {1} |