US PATENT SUBCLASS 257 / 759
.~.~.~.~ Including organic insulating material between metal levels

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

734  DF  COMBINED WITH ELECTRICAL CONTACT OR LEAD {14}
741  DF  .~ Of specified material other than unalloyed aluminum {10}
750  DF  .~.~ Layered {10}
758  DF  .~.~.~ Multiple metal levels on semiconductor, separated by insulating layer (e.g., multiple level metallization for integrated circuit) {2}
759.~.~.~.~ Including organic insulating material between metal levels

DEFINITION

Classification: 257/759

Including organic insulating material between metal levels:

(under subclass 758) Subject matter wherein there is at least one layer of organic insulating material between different layers of metal. An organic compound is one which fulfills the requirements of the Class 260 definition, i.e., has a molecule characterized by two carbon atoms bonded together, one atom of carbon being bonded to at least one atom of hydrogen or a halogen, or one atom or carbon bonded to at least one atom of nitrogen by a single or double bond, certain compounds such as HCN, CN-CN, HNCO, HNCS, cyanogen halides, cyanamide, fulminic acid and metal carbides, being exceptions to this rule.