US PATENT SUBCLASS 257 / 719
.~.~.~ Pressed against semiconductor element

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

678  DF  HOUSING OR PACKAGE {18}
712  DF  .~ With provision for cooling the housing or its contents {6}
718  DF  .~.~ Heat dissipating element held in place by clamping or spring means {1}
719.~.~.~ Pressed against semiconductor element

DEFINITION

Classification: 257/719

Pressed against semiconductor element:

(under subclass 718) Subject matter wherein the heat dissipating element and the active device are in press contact with each other.