| 257 / | HD | ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES) |
|
| 678 | DF | HOUSING OR PACKAGE {18} |
| 712 |  | .~ With provision for cooling the housing or its contents {6} |
| 713 | DF | .~.~> For integrated circuit |
| 714 | DF | .~.~> Liquid coolant {2} |
| 717 | DF | .~.~> Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer) |
| 718 | DF | .~.~> Heat dissipating element held in place by clamping or spring means {1} |
| 720 | DF | .~.~> Heat dissipating element has high thermal conductivity insert (e.g., copper slug in aluminum heat sink) |
| 721 | DF | .~.~> With gas coolant {1} |