257 / | HD | ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES) |
|
678 | | HOUSING OR PACKAGE {18} |
679 | DF | .~> Smart (e.g., credit) card package |
680 | DF | .~> With window means {1} |
682 | DF | .~> With desiccant, getter, or gas filling |
683 | DF | .~> With means to prevent explosion of package |
684 | DF | .~> With semiconductor element forming part (e.g., base, of housing) |
685 | DF | .~> Multiple housings {1} |
687 | DF | .~> Housing or package filled with solid or liquid electrically insulating material |
688 | DF | .~> With large area flexible electrodes in press contact with opposite sides of active semiconductor chip and surrounded by an insulating element (e.g., ring) {1} |
690 | DF | .~> With contact or lead {4} |
701 | DF | .~> Insulating material {5} |
708 | DF | .~> Entirely of metal except for feedthrough {3} |
712 | DF | .~> With provision for cooling the housing or its contents {6} |
723 | DF | .~> For plural devices {2} |
727 | DF | .~> Device held in place by clamping |
728 | DF | .~> For high frequency (e.g., microwave) device |
729 | DF | .~> Portion of housing of specific materials |
730 | DF | .~> Outside periphery of package having specified shape or configuration |
731 | DF | .~> With housing mount {2} |