US PATENT SUBCLASS 257 / 688
.~ With large area flexible electrodes in press contact with opposite sides of active semiconductor chip and surrounded by an insulating element (e.g., ring)

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

678  DF  HOUSING OR PACKAGE {18}
688.~ With large area flexible electrodes in press contact with opposite sides of active semiconductor chip and surrounded by an insulating element (e.g., ring) {1}
689  DF  .~.~> Rigid electrode portion

DEFINITION

Classification: 257/688

With large area flexible electrodes in press contact with opposite sides of active semiconductor chip and surrounded by an insulating element, e.g., ring:

(under subclass 678) Subject matter wherein the package or housing has two large area electrodes which are in press contact with opposite sides of a semiconductor chip and wherein the electrode edges are surrounded by an electrically insulating medium (e.g., a ring).

(1) Note. Search this class, subclass 181 for such housings which specifically contain a regenerative active solid-state device (e.g., an SCR or thyristor).

SEE OR SEARCH THIS CLASS, SUBCLASS:

181+, for similar electrodes with regenerative type devices.

785, for electrodes combined with an active semiconductor electronic device by pressure alone.