US PATENT SUBCLASS 257 / 687
.~ Housing or package filled with solid or liquid electrically insulating material

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

678  DF  HOUSING OR PACKAGE {18}
687.~ Housing or package filled with solid or liquid electrically insulating material

DEFINITION

Classification: 257/687

Housing or package filled with solid or liquid electrically insulating material:

(under subclass 678) Subject matter wherein the housing or package is filled with a solid or liquid electrically insulating material.

(1) Note. Encapsulated devices are excluded from this subclass and are not considered to be housings or packages as defined in subclass 678 which requires them to be preformed.

SEE OR SEARCH CLASS

361, Electricity: Electrical Systems and Devices,

729, 730+, and 744+ for various modules for printed circuit boards.