US PATENT SUBCLASS 257 / 718
.~.~ Heat dissipating element held in place by clamping or spring means

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

678  DF  HOUSING OR PACKAGE {18}
712  DF  .~ With provision for cooling the housing or its contents {6}
718.~.~ Heat dissipating element held in place by clamping or spring means {1}
719  DF  .~.~.~> Pressed against semiconductor element

DEFINITION

Classification: 257/718

Heat dissipating element held in place by clamping or spring means:

(under subclass 712) Subject matter wherein an element for dissipating heat is held in place by means to clamp it to the device or vice versa, or by a spring to position the device and heat dissipating element in thermal contact with each other.