US PATENT SUBCLASS 257 / 720
.~.~ Heat dissipating element has high thermal conductivity insert (e.g., copper slug in aluminum heat sink)

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

678  DF  HOUSING OR PACKAGE {18}
712  DF  .~ With provision for cooling the housing or its contents {6}
720.~.~ Heat dissipating element has high thermal conductivity insert (e.g., copper slug in aluminum heat sink)

DEFINITION

Classification: 257/720

Heat dissipating element has high thermal conductivity insert (e.g., copper slug in aluminum heat sink):

(under subclass 712) Subject matter wherein the heat dissipating element has a relatively high thermal conductivity vis-a-vis a larger (main) heat sink into which it is inserted (e.g., a copper slug in an aluminum heat

sink).