US PATENT SUBCLASS 216 / 90
.~ Relative movement between the substrate and a confined pool of etchant

Current as of: June, 1999
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216 /   HD   ETCHING A SUBSTRATE: PROCESSES

83  DF  NONGASEOUS PHASE ETCHING OF SUBSTRATE {9}
90.~ Relative movement between the substrate and a confined pool of etchant {1}
91  DF  .~.~> Rotating, repeated dipping, or advancing movement of substrate

DEFINITION

Classification: 216/90

Relative movement between the substrate and a confined pool of etchant:

(under subclass 83) Process including the step of causing a relative motion between a substrate being etched and an etchant which is confined in a container, (e.g., dipping, ultrasonic vibrating., etc.):

(1) Note. The substrate being etched may also serve as the container.

(2) Note. Boiling a liquid etchant is not considered sufficient for this subclass without disclosure that it is boiled to establish relative motion.