US PATENT SUBCLASS 216 / 89
.~.~ Etchant contains solid particle (e.g., abrasive for polishing, etc.)

Current as of: June, 1999
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216 /   HD   ETCHING A SUBSTRATE: PROCESSES

83  DF  NONGASEOUS PHASE ETCHING OF SUBSTRATE {9}
88  DF  .~ Using film of etchant between a stationary surface and a moving surface (e.g., chemical lapping, etc.) {1}
89.~.~ Etchant contains solid particle (e.g., abrasive for polishing, etc.)

DEFINITION

Classification: 216/89

Etchant contains solid particle (e.g., abrasive for polishing, etc.):

(under subclass 88) Process wherein the etchant also contains solid particles.