US PATENT SUBCLASS 216 / 65
.~.~ Using laser

Current as of: June, 1999
Click HD for Main Headings
Click for All Classes

Internet Version by PATENTEC © 1999      Terms of Use


216 /   HD   ETCHING A SUBSTRATE: PROCESSES

58  DF  GAS PHASE ETCHING OF SUBSTRATE {6}
63  DF  .~ Application of energy to the gaseous etchant or to the substrate being etched {4}
65.~.~ Using laser

DEFINITION

Classification: 216/65

Using laser:

(under subclass 63) Process wherein the energy source is a laser.

(1) Note. Either visible or invisible laser may be used in this etching process.

SEE OR SEARCH CLASS

522, Synthetic Resins or Natural Rubbers,

2, for forming or modifying a solid polymer by laser, or compositions therefor.